Press Release

**SAN JOSE, Calif., October 2, 2026** – As artificial intelligence drives unprecedented growth in computing demand, the data center industry is being challenged to scale infrastructure while improving efficiency, flexibility, and sustainability. Reflecting the 2026 OCP Global Summit theme, “Scaling Innovation for the AI Era,” Inventec Corporation will showcase its latest AI infrastructure portfolio at the 2026 OCP Global Summit, taking place October 12–15 at the San Jose Convention Center. As a Diamond Sponsor, Inventec will demonstrate at Booth C21 how rack-scale systems, accelerated computing, heterogeneous platforms, and modular infrastructure can work together to address the evolving requirements of AI data centers at scale.

At the center of Inventec’s showcase is its expanding rack-scale AI infrastructure portfolio. Artemis III, Inventec’s rack solution featuring NVIDIA Vera Rubin NVL72 and Spectrum-X Ethernet networking, is designed to address demanding AI training, inference, and agentic reasoning workloads for next-generation AI factories. Alongside Artemis III, Inventec will showcase an Inventec-defined rack solution, demonstrating its rack-level design and integration capabilities beyond partner-defined architectures. Drawing from Inventec’s broad server portfolio, customers can select the computing platform that best fits their workload and deployment requirements and scale it into a complete rack solution. Together, the two rack showcases demonstrate Inventec’s ability to deliver both partner-defined and Inventec-defined rack solutions, providing greater flexibility for customers building AI infrastructure at scale.

Extending this flexibility across a broad range of computing platforms, Inventec will showcase its family of liquid-cooled AI servers powered by Intel® Xeon® 6 processors, including the P2000G7 and P5880G7 with NVIDIA HGX Rubin NVL8, the P5800G7 based on NVIDIA HGX B300 system, and the P600G7, based on the NVIDIA MGX architecture with NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs. Inventec will also feature the K709G8, powered by NVIDIA Vera CPU, further expanding its Arm-based AI computing portfolio. Together, these systems give customers a range of computing platforms to address different AI training, inference, enterprise AI, and high-performance computing requirements, while providing the building blocks for Inventec-defined rack-scale solutions. 

As AI workloads continue to diversify, Inventec is also expanding its heterogeneous computing portfolio to provide greater platform choice. The P9500AG7, powered by 5th Gen AMD EPYC™ processors and AMD Instinct™ MI355X GPUs, together with the P5000AG7, featuring 5th Gen AMD EPYC™ processors and AMD Instinct™ MI350P GPUs, delivers high-performance solutions for AI training, inference, and HPC applications. Furthermore, Inventec will highlight its Containerized Data Center Solution, developed in collaboration with Intel. Powered by Intel® Xeon® 6 processors, the solution integrates compute, networking, power, and cooling infrastructure into a modular architecture designed for rapid deployment and scalable expansion, helping customers simplify AI data center deployment and efficiently scale infrastructure to meet evolving workload demands.

Visitors are invited to meet Inventec at Booth C21 at the San Jose Convention Center, October 12–15, to explore its latest AI infrastructure solutions and discover how Inventec can support customers across every stage of AI infrastructure deployment, from individual systems and complete rack solutions to data center buildout. With its system design, integration capabilities, and broad technology ecosystem, Inventec helps customers build scalable AI infrastructure tailored to their evolving workloads and deployment requirements.